Der globale Markt für Rückschleifbänder wird voraussichtlich von 2019 bis 2028 um mehr als 7,6 % durchschnittliche jährliche Wachstumsrate wachsen. Es wird erwartet, dass der Markt von etwas über 166 Millionen USD im Jahr 2019 auf über 303 Millionen USD im Jahr 2028 ansteigt.
Back Grinding Tapes (BGT) dienen dem Schutz der Waferoberfläche während des Back-Grinding-Prozesses nach der Herstellung des integrierten Schaltkreises (IC) auf dem Wafer. Wenn sie auf der Schaltkreisoberfläche angebracht werden, wirken sie als Schutzbarriere gegen Beschädigungen und Verunreinigungen und verbessern so die Präzision des Waferschleifens. Diese Bänder haften an der Schaltkreisoberfläche, die während der Halbleiter-Frontend-Prozesse auf Silizium-Wafern gebildet wird.
Beim Schleifen der Rückseite von Wafern dienen diese Bänder dazu, die Schaltkreise vor Fremdpartikeln und physikalischen Einflüssen zu schützen. Daher müssen sie die Eigenschaften aufweisen, dass die Schaltkreisoberflächen möglichst wenig verunreinigt werden, sich leicht lösen lassen und sich den Oberflächenunregelmäßigkeiten des Schaltkreises anpassen. Aufgrund ihrer Haftung an der Schaltkreisoberfläche von Siliziumwafern ist es zwingend erforderlich, dass BG-Bänder keine Verunreinigungen einbringen. Die abnehmende Dicke der Wafer nach dem Schleifen der Rückseite ist auf die Ausdünnung der Filme auf den Siliziumwafern zurückzuführen .
Die Gewährleistung mikrobiologischer Reinheit durch Oberflächen- und Luftdesinfektionsbehandlungen ist in verschiedenen Bereichen wie Pharmazie, Medizin, Forensik und biologischen Laboren von entscheidender Bedeutung. Diese Umgebungen erfordern strenge Isolationsbedingungen, um unterbrechungsfreie Abläufe zu unterstützen, was möglicherweise zur Verwendung solcher Bänder führt. Darüber hinaus erkennt die Gastronomie zunehmend den Nutzen von Back Grinding Tapes (BGT).
These tapes find widespread applications in air, surface, and water treatment, among others. The development of new products and variations aims primarily at bolstering market growth. With increasing expenditure on social infrastructure, the global market is anticipated to expand over the forecast period. The proliferation of UV equipment and governmental initiatives worldwide to establish new water and wastewater treatment facilities further contribute to this growth. Additionally, they are commonly employed during the latter stages of the healing process. Consequently, the Back Grinding Tapes market (BGT) is poised for expansion in the foreseeable future.
On the basis of Type, the Global Back Grinding Tapes Market has been segmented into UV Type and Non-UV Type.
UV Tape is adhesive tape for semiconductor process. It is suitable to protect surface of semiconductor wafer during back grinding process, and to hold semiconductor wafer with ring frame during dicing process. UV curable type tape achieves easier peeling after reducing adhesion by UV irradiation. UV type tapes show no water penetration and wafer breakage during grinding due to its higher adhesion strength compared to conventional types.
Non-UV Type is designed to peel-off from wafer/substrate material without UV irradiation. Conventional BG tapes have normally a much lower adhesion strength compared to UV type tapes. Hence, a little contamination could be transferred to the wafer surface. These type BG tape encountered broken wafer or detachment of the passivation layer after detaping.
On the basis of Application, the Global Back Grinding Tapes Market has been classified as Standard, Standard Thin Die, (S)DBG (GAL), Bump. Standard back grinder has a rotating work chuck, across the Centre of which a rotating diamond cup wheel sweeps. Downward movement of the spindle carrying the cup wheel removes material from the surface of the wafer, creating a flat surface. These are simple and doesn’t require special adhesion and specifications.
Standard thin die is known to separate and handle integrated circuits on thin semiconductor die by mechanical grinding, chemical etching and dry etching with the assistance of adhesive or UV related release tapes and carrier wafers. Some of the approaches taken in the electronics industry to separate thin wafers into dice and handle thin dice include dicing by cutting and dicing by thinning.
The DBG process requires a back-grinding tape that has the following attributes, a) strong adhesive force (Prevents infiltration of grinding fluid and die dust during grinding), b) absorption and/or relief of compression stress and shear stress during grinding, c) suppresses cracking due to contact between dies, d) adhesive strength that can be greatly reduced through UV irradiation.
Wafer bumping is replacing wire bonding as the interconnection of choice for a growing number of components. The use of wafer bumping is driven either by performance, form factor or array interconnect requirements. The bumped wafer may be thinned without damaging the bumps and the active surface of the wafer.
The Global Back Grinding Tapes Market is highly consolidated with limited multi-national, regional, and local manufacturers. It is categorized by the presence of standard companies at the local, regional, and international levels. The industry is dominated by Asian suppliers, majority of the companies are producing in Asian countries such as Taiwan, China, Korea, and Japan.
Some of the major companies are Mitsui Chemicals Tohcello, Furukawa Electric, Nitto, Denka, Lintec, AI Technology, AMC Co., LG Chem, Sumitomo Bakelite, Daehyun St, KGK Chemical Corporation, Minitron Elektronik GmBH, Pantech Tape, and Force-One Applied Materials Inc. These companies account for significant share owing to their extensive product portfolio, wide regional presence and adoption of growth strategies.
Geographically, the global Back Grinding Tapes market is segmented into North America, South America, Europe, APAC and MEA. Asia Pacific region is witnessing the growth in market.
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